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ADG1213YCPZ-500RL7 - Analog Devices

Description: Analog Switch ICs +/-15V QUAD SWITCH/MUX WITH LOW CAP I.C.

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ADG1213YCPZ-500RL7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-16-21
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3D Models
ADG1213YCPZ-500RL7 - Analog Devices  - 3D model - Quad Flat No-Lead - CP-16-21
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ADG1213YCPZ-500RL7 Details

  • Manufacturer Part Number:

    ADG1213YCPZ-500RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    LFCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CP-16-21

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATES AT +12 V SUPPLY

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Max (Vsup):

    -16.5 V

  • Neg Supply Voltage-Min (Vsup):

    -13.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NO/NC

  • Number of Channels:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    75 dB

  • On-state Resistance Match-Nom:

    5 Ω

  • On-state Resistance-Max (Ron):

    120 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Signal Current-Max:

    0.025 A

  • Supply Current-Max (Isup):

    0.38 mA

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    13.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    130 ns

  • Switch-on Time-Max:

    160 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ADG1213YCPZ-500RL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG1213YCPZ-500RL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. Additionally, it's recommended to place the device close to the analog signal sources and to use a low-ESR capacitor for decoupling.
  • To ensure reliability in high-temperature applications, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive material for the PCB, and avoiding overheating. Additionally, it's recommended to derate the device's power consumption and to use a thermal interface material to improve heat transfer.
  • To minimize EMI and RFI, it's recommended to use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead to filter the power supply lines. Additionally, it's essential to follow proper PCB layout practices, such as using a solid ground plane and minimizing the length of the signal traces.
  • To troubleshoot issues with the ADG1213YCPZ-500RL7, start by verifying the power supply voltage and ensuring that it's within the recommended range. Check the device's temperature and ensure that it's within the specified operating range. Use an oscilloscope to verify the signal integrity and check for any signs of noise or distortion. If the issue persists, consult the datasheet and application notes for troubleshooting guidelines.
  • For high-reliability applications, it's essential to follow a rigorous testing and validation process, including environmental testing, burn-in, and accelerated life testing. Additionally, it's recommended to use a redundant design, implement error detection and correction mechanisms, and follow a robust design verification process.

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ADG1213YCPZ-500RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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