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ADG1412YCPZ-REEL - Analog Devices

Description: Analog Switch ICs 1.8 Ohm 250mA iCMOS Quad SPST

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ADG1412YCPZ-REEL - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-16-26 (LFCSP)
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ADG1412YCPZ-REEL - Analog Devices  - 3D model - Quad Flat No-Lead - CP-16-26 (LFCSP)
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ADG1412YCPZ-REEL Details

  • Manufacturer Part Number:

    ADG1412YCPZ-REEL

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    4 X 4 MM, ROHS COMPLIANT, MO-220VGGC, LFCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CP-16-26

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    CAN ALSO OPERATES AT 12 V AND +/-15 V SUPPLY

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Max (Vsup):

    -16.5 V

  • Neg Supply Voltage-Min (Vsup):

    -4.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    80 dB

  • On-state Resistance Match-Nom:

    0.13 Ω

  • On-state Resistance-Max (Ron):

    5.4 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Signal Current-Max:

    0.25 A

  • Supply Current-Max (Isup):

    0.38 mA

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    380 ns

  • Switch-on Time-Max:

    510 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4 mm

ADG1412YCPZ-REEL Frequently Asked Questions (FAQs)

  • A recommended PCB layout for the ADG1412YCPZ-REEL is to use a 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the device to dissipate heat. Additionally, it is recommended to use a thermal pad on the top layer to connect to the thermal pad on the device.
  • To ensure the ADG1412YCPZ-REEL is properly powered and decoupled, it is recommended to use a low-ESR capacitor (e.g. 0.1uF) between the VDD and GND pins, and to place a 10uF capacitor between the VDD and GND pins for bulk decoupling. Additionally, it is recommended to use a low-dropout regulator (LDO) to power the device.
  • The maximum operating frequency of the ADG1412YCPZ-REEL is 100 MHz. However, the actual operating frequency may be limited by the specific application and the quality of the PCB layout.
  • The thermal shutdown feature of the ADG1412YCPZ-REEL is designed to protect the device from overheating. If the device exceeds the maximum junction temperature (150°C), it will shut down until the temperature drops below the threshold. To handle thermal shutdown, it is recommended to implement a thermal monitoring system to detect when the device is approaching the thermal shutdown threshold, and to take corrective action to reduce the power consumption or improve the thermal dissipation.
  • The recommended reflow soldering profile for the ADG1412YCPZ-REEL is a peak temperature of 260°C, with a ramp-up rate of 3°C/s, a dwell time of 30-60 seconds, and a cool-down rate of 6°C/s. However, the actual reflow profile may vary depending on the specific PCB material and component density.

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ADG1412YCPZ-REEL Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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