Part Image

ADG1422BCPZ-REEL7 - Analog Devices

Description: Analog Switch ICs 2.5ohm Max Ron +/-15V iCMOS Dual SPST

Download ADG1422BCPZ-REEL7 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
ADG1422BCPZ-REEL7 - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - 10-Lead Lead Frame Chip Scale Package
click to zoom
3D Models
ADG1422BCPZ-REEL7 - Analog Devices  - 3D model - Small Outline No-lead - 10-Lead Lead Frame Chip Scale Package
click to zoom

ADG1422BCPZ-REEL7 Details

  • Manufacturer Part Number:

    ADG1422BCPZ-REEL7

  • Source Url Status Check Date:

    2013-05-01 14:56:36.517

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    3 X 3 MM, ROHS COMPLIANT, LFCSP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    CP-10-9

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATES ON PLUS OR MINUS 15V AND PLUS 12V

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Max (Vsup):

    -5.5 V

  • Neg Supply Voltage-Min (Vsup):

    -4.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Normal Position:

    NC

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    60 dB

  • On-state Resistance Match-Nom:

    0.04 Ω

  • On-state Resistance-Max (Ron):

    7 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Signal Current-Max:

    0.25 A

  • Supply Current-Max (Isup):

    0.19 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    395 ns

  • Switch-on Time-Max:

    520 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ADG1422BCPZ-REEL7 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for the ADG1422BCPZ-REEL7 is to use a 4-layer board with a solid ground plane, and to place thermal vias under the package to dissipate heat. Additionally, keeping the analog and digital grounds separate and using a star-grounding configuration can help minimize noise and thermal resistance.
  • To ensure proper powering and decoupling of the ADG1422BCPZ-REEL7, use a low-ESR capacitor (e.g., 0.1 μF) between the VDD and GND pins, and a larger capacitor (e.g., 10 μF) between the VDD and GND pins for bulk decoupling. Additionally, use a low-dropout regulator (LDO) or a switching regulator with a low output voltage ripple to power the device.
  • The ADG1422BCPZ-REEL7 can operate up to 100 kHz, but the maximum operating frequency depends on the specific application and the analog signal frequency. It's recommended to consult the datasheet and application notes for more information on frequency planning and signal integrity.
  • To protect the ADG1422BCPZ-REEL7 from ESD, handle the device by the body or use an ESD wrist strap, and use ESD-protected workstations and equipment. Additionally, use ESD-protection devices such as TVS diodes or ESD-protection arrays on the PCB to protect the device from ESD events.
  • The recommended soldering profile for the ADG1422BCPZ-REEL7 is a reflow soldering process with a peak temperature of 260°C (500°F) for a maximum of 20 seconds. It's recommended to consult the datasheet and application notes for more information on soldering and assembly guidelines.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

ADG1422BCPZ-REEL7 Overview

Use the download button to access the ADG1422BCPZ-REEL7 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ADG14, or try a keyword search, such as Multiplexers or Switches

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

Parts related to ADG1422BCPZ-REEL7

Showing 0 results