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ADG3245BRUZ - Analog Devices

Description: Translation - Voltage Levels 2.2V/3.3v,8 Bit,2 Port Bus Sw/Trans

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ADG3245BRUZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 20-Lead Thin Shrink Small Outline Package [TSSOP] (RU-20)
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ADG3245BRUZ - Analog Devices  - 3D model - Small Outline Packages - 20-Lead Thin Shrink Small Outline Package [TSSOP] (RU-20)
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ADG3245BRUZ Details

  • Manufacturer Part Number:

    ADG3245BRUZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    MO-153AC, TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    RU-20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    3245

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.225 ns

  • Propagation Delay (tpd):

    0.225 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4.4 mm

ADG3245BRUZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG3245BRUZ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help reduce EMI and noise.
  • To ensure proper powering and decoupling of the ADG3245BRUZ, use a high-quality, low-ESR capacitor (e.g., 10uF ceramic) between the VCC and GND pins, and a smaller capacitor (e.g., 100nF ceramic) between the VCC and AVCC pins. Also, use a separate power supply for the analog and digital sections.
  • The ADG3245BRUZ can achieve a maximum data transfer rate of up to 100 Mbps, depending on the specific application and system design.
  • To handle thermal management of the ADG3245BRUZ, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the airflow around the device. Also, follow the recommended operating temperature range of -40°C to +125°C.
  • The recommended termination resistors for the ADG3245BRUZ are 50Ω for the differential pairs and 1kΩ for the single-ended signals. However, the optimal termination resistors may vary depending on the specific application and system design.

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ADG3245BRUZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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