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ADG333ABRZ - Analog Devices

Description: Analog Devices ADG333ABRZ, Analogue SPDT Switch Quad SPDT, 20-Pin SOIC W

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ADG333ABRZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RW-20 (SOIC)
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ADG333ABRZ Details

  • Manufacturer Part Number:

    ADG333ABRZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    RW-20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Channels:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    20

  • Off-state Isolation-Nom:

    72 dB

  • On-state Resistance Match-Nom:

    4 Ω

  • On-state Resistance-Max (Ron):

    45 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Signal Current-Max:

    0.02 A

  • Supply Current-Max (Isup):

    0.35 mA

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    145 ns

  • Switch-on Time-Max:

    175 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

ADG333ABRZ Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VCC first, followed by VEE, and then the logic inputs. This ensures proper device operation and prevents latch-up.
  • To ensure the switches are turned off during power-down, apply a low logic level to the control inputs (S1-S4) before powering down VCC and VEE. This ensures the switches are in a high-impedance state during power-down.
  • The maximum voltage that can be applied to the analog inputs is VCC + 0.3 V or VEE - 0.3 V, whichever is less. Exceeding this voltage can cause damage to the device.
  • To minimize power consumption when the device is not in use, apply a low logic level to the control inputs (S1-S4) and ensure VCC and VEE are at their minimum specified values. This reduces the quiescent current and minimizes power consumption.
  • The recommended PCB layout involves placing the device near the analog circuitry, using short traces, and minimizing the distance between the device and the analog circuitry. This helps to reduce noise and improve overall system performance.

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ADG333ABRZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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