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ADG5243FBCPZ-RL7 - Analog Devices

Description: User Defined Fault Protection and Detection, 0.8 pC QINJ, Triple SPDT

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ADG5243FBCPZ-RL7 - Analog Devices - PCB symbol
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PCB Footprints
ADG5243FBCPZ-RL7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 20–Lead, Lead Frame Chip Scale Package_20
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ADG5243FBCPZ-RL7 - Analog Devices - 3D model - Quad Flat No-Lead - 20–Lead, Lead Frame Chip Scale Package_20
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ADG5243FBCPZ-RL7 Details

  • Manufacturer Part Number:

    ADG5243FBCPZ-RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    CP-20-8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    S-XQCC-N20

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Max (Vsup):

    -22 V

  • Neg Supply Voltage-Min (Vsup):

    -5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Channels:

    1

  • Number of Functions:

    3

  • Number of Terminals:

    20

  • Off-state Isolation-Nom:

    74 dB

  • On-state Resistance Match-Nom:

    4 Ω

  • On-state Resistance-Max (Ron):

    250 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Signal Current-Max:

    0.029 A

  • Supply Current-Max (Isup):

    2.8 mA

  • Supply Voltage-Max (Vsup):

    22 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    230 ns

  • Switch-on Time-Max:

    215 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

ADG5243FBCPZ-RL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG5243FBCPZ-RL7 involves keeping the signal traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended. Additionally, it's essential to follow the layout guidelines provided in the datasheet and application notes.
  • To ensure proper power and decoupling, connect the VDD pin to a clean, low-noise power supply, and decouple it with a 0.1 μF ceramic capacitor to GND. Additionally, place a 10 μF capacitor in parallel to further reduce noise. Make sure to follow the power supply sequencing guidelines in the datasheet to prevent latch-up.
  • The ADG5243FBCPZ-RL7 is designed to operate up to 100 MHz, but the actual operating frequency may be limited by the specific application and PCB layout. It's essential to evaluate the device's performance in the target application and ensure it meets the required specifications.
  • To prevent ESD damage, handle the ADG5243FBCPZ-RL7 with an anti-static wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the device's pins or exposed internal components, and use ESD-safe packaging and storage materials.
  • The ADG5243FBCPZ-RL7 has a maximum junction temperature of 150°C. To ensure reliable operation, maintain a maximum ambient temperature of 85°C, and use a heat sink or thermal pad if the device is expected to dissipate significant power. Follow the thermal management guidelines in the datasheet and application notes.

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ADG5243FBCPZ-RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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