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ADG5412BCPZ-REEL7 - Analog Devices

Description: Analog Switch ICs +/-20V Latchup Proof quad SPST

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ADG5412BCPZ-REEL7 - Analog Devices - PCB symbol
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PCB Footprints
ADG5412BCPZ-REEL7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-16-17 (LFCSP)
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ADG5412BCPZ-REEL7 - Analog Devices - 3D model - Quad Flat No-Lead - CP-16-17 (LFCSP)
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ADG5412BCPZ-REEL7 Details

  • Manufacturer Part Number:

    ADG5412BCPZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    LFCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CP-16-17

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Max (Vsup):

    -16.5 V

  • Neg Supply Voltage-Min (Vsup):

    -13.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    78 dB

  • On-state Resistance Match-Nom:

    0.35 Ω

  • On-state Resistance-Max (Ron):

    11 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Signal Current-Max:

    0.17 A

  • Supply Current-Max (Isup):

    0.13 mA

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    13.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    182 ns

  • Switch-on Time-Max:

    262 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

ADG5412BCPZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG5412BCPZ-REEL7 should include a solid ground plane, decoupling capacitors near the device, and a thermal pad connected to a heat sink or a large copper area to dissipate heat. Additionally, keep sensitive analog traces away from digital traces and ensure good shielding to minimize EMI.
  • The ADG5412BCPZ-REEL7 requires a single 3.3V or 5V power supply. Ensure that the power supply is clean and well-regulated. Power sequencing is not critical, but it is recommended to power up the device after the power supply has stabilized. Also, ensure that the power supply can provide the required current to the device.
  • The ADG5412BCPZ-REEL7 can operate up to 100 MHz. However, the device's performance may degrade at higher frequencies due to increased power consumption, heat generation, and signal attenuation. Ensure that the device is operated within its recommended frequency range to maintain optimal performance.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins of the ADG5412BCPZ-REEL7. Also, ensure that the device is operated within its recommended voltage range and that the power supply is protected from overvoltage conditions using voltage regulators or overvoltage protection devices.
  • The thermal resistance of the ADG5412BCPZ-REEL7 is typically around 25°C/W. High thermal resistance can lead to increased junction temperature, which can affect the device's reliability and lifespan. Ensure good thermal management by using heat sinks, thermal pads, or other cooling mechanisms to keep the junction temperature below 125°C.

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ADG5412BCPZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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