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ADG636YRUZ-REEL - Analog Devices

Description: Analogue Switch ICs +/-5V, Dual 2:1 MUX with 1pC Qinj I.C.

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ADG636YRUZ-REEL - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 14-Lead Thin Shrink Small Outline Package [TSSOP]
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ADG636YRUZ-REEL - Analog Devices  - 3D model - Small Outline Packages - 14-Lead Thin Shrink Small Outline Package [TSSOP]
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ADG636YRUZ-REEL Details

  • Manufacturer Part Number:

    ADG636YRUZ-REEL

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    RU-14

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Max (Vsup):

    -5.5 V

  • Neg Supply Voltage-Min (Vsup):

    -2.7 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Normal Position:

    NC

  • Number of Channels:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    14

  • Off-state Isolation-Nom:

    65 dB

  • On-state Resistance Match-Nom:

    2 Ω

  • On-state Resistance-Max (Ron):

    115 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Signal Current-Max:

    0.01 A

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    80 ns

  • Switch-on Time-Max:

    135 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

ADG636YRUZ-REEL Frequently Asked Questions (FAQs)

  • Analog Devices provides a recommended PCB layout and land pattern in the ADG636 evaluation board documentation, which can be found on their website. It's essential to follow these guidelines to ensure proper thermal management, signal integrity, and minimize parasitic effects.
  • The ADG636YRUZ-REEL has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via array or a copper pour connected to a ground plane can be used. Ensure that the thermal plane is not electrically connected to any signal lines to prevent noise coupling.
  • The recommended power-up sequence is to apply VDD first, followed by VSS. This ensures that the internal circuitry is properly biased and configured before the analog signals are applied. A power-up sequence diagram can be found in the datasheet.
  • To minimize EMI and RFI effects, use a multi-layer PCB with a solid ground plane, keep signal traces short and away from the edges, and use shielding or guard rings around sensitive nodes. Additionally, ensure that the ADG636YRUZ-REEL is placed in a shielded area of the PCB and that the analog and digital grounds are separated.
  • The ADG636YRUZ-REEL is rated for operation from -40°C to +125°C. However, the device's performance may degrade at extreme temperatures. It's essential to ensure that the device is operated within the recommended temperature range to maintain its specified performance.

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ADG636YRUZ-REEL Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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