Part Image

ADG658YCPZ-REEL7 - Analog Devices

Description: +3V/+5V/ 5V CMOS 8-Channel Analog Multiplexer 4 mm × 4 mm Body and 0.75 mm

Download ADG658YCPZ-REEL7 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
ADG658YCPZ-REEL7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 4 mm × 4 mm Body, Very Very Thin Quad (CP-16-23)
click to zoom
3D Models
ADG658YCPZ-REEL7 - Analog Devices  - 3D model - Quad Flat No-Lead - 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 4 mm × 4 mm Body, Very Very Thin Quad (CP-16-23)
click to zoom

ADG658YCPZ-REEL7 Details

  • Manufacturer Part Number:

    ADG658YCPZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    LFCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CP-16-23

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATE WITH 2 V TO 12 V

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Max (Vsup):

    -6 V

  • Neg Supply Voltage-Min (Vsup):

    -2 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Normal Position:

    NC

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    90 dB

  • On-state Resistance Match-Nom:

    2 Ω

  • On-state Resistance-Max (Ron):

    400 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Signal Current-Max:

    0.02 A

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    110 ns

  • Switch-on Time-Max:

    490 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

ADG658YCPZ-REEL7 Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern for the ADG658YCPZ-REEL7 can be found in the Analog Devices' application note AN-1111, which provides guidelines for PCB design and layout to ensure optimal performance and minimize parasitic effects.
  • The ADG658YCPZ-REEL7 has built-in ESD protection, but additional protection measures can be taken by following the guidelines in the Analog Devices' application note AN-873, which provides recommendations for ESD protection and handling of sensitive devices.
  • The recommended power-up sequence for the ADG658YCPZ-REEL7 is to power up the VDD supply before the VSS supply. This ensures that the internal circuitry is properly biased and prevents any potential latch-up conditions.
  • The optimal decoupling capacitor values for the ADG658YCPZ-REEL7 can be determined by following the guidelines in the Analog Devices' application note AN-724, which provides recommendations for decoupling capacitor selection and placement.
  • The thermal management strategy for the ADG658YCPZ-REEL7 involves ensuring good thermal conductivity between the device and the PCB, using thermal vias and thermal pads, and following the guidelines in the Analog Devices' application note AN-1023, which provides recommendations for thermal management and heat sinking.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

ADG658YCPZ-REEL7 Overview

Use the download button to access the ADG658YCPZ-REEL7 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ADG65, or try a keyword search, such as Multiplexers or Switches

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

Parts related to ADG658YCPZ-REEL7

Showing 0 results