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ADG701BRMZ - Analog Devices

Description: SPST analogue switch,ADG701BRM 6ohm

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PCB Footprints
ADG701BRMZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSOP-8_2020-1
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3D Models
ADG701BRMZ - Analog Devices  - 3D model - Small Outline Packages - MSOP-8_2020-1
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ADG701BRMZ Details

  • Manufacturer Part Number:

    ADG701BRMZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    LEAD FREE, MO-187AA, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    RM-8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Off-state Isolation-Nom:

    55 dB

  • On-state Resistance-Max (Ron):

    5 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.03 A

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    13 ns

  • Switch-on Time-Max:

    20 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ADG701BRMZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG701BRMZ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance.
  • To ensure reliable communication, use a proper SPI protocol, ensure clock synchronization, and implement error checking and correction mechanisms, such as CRC or checksums, to detect and correct data transmission errors.
  • The ADG701BRMZ has a maximum junction temperature of 150°C. Ensure good thermal conductivity by using a heat sink, thermal interface material, and a PCB design that allows for efficient heat dissipation.
  • Use proper shielding, grounding, and filtering techniques to minimize EMI. Ensure the ADG701BRMZ is placed in a shielded area, and use EMI filters or common-mode chokes to reduce emissions.
  • Ensure that the power supplies are sequenced correctly, with the analog supply (VDDA) powered up before the digital supply (VDDD). Also, ensure that the supply voltage is within the recommended range of 2.7V to 5.5V.

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ADG701BRMZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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