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ADG702BRMZ - Analog Devices

Description: Analog Switch Single SPST 8-Pin MSOP

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ADG702BRMZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSOP-8_2020-1
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ADG702BRMZ - Analog Devices  - 3D model - Small Outline Packages - MSOP-8_2020-1
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ADG702BRMZ Details

  • Manufacturer Part Number:

    ADG702BRMZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    LEAD FREE, MO-187AA, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    RM-8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Off-state Isolation-Nom:

    55 dB

  • On-state Resistance-Max (Ron):

    5 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.03 A

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    13 ns

  • Switch-on Time-Max:

    20 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ADG702BRMZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG702BRMZ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance.
  • To ensure reliable communication, use a proper SPI protocol, ensure clock synchronization, and implement error checking and correction mechanisms. Also, consider using a buffer or repeater to extend the distance between the ADG702BRMZ and the microcontroller.
  • The ADG702BRMZ has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and avoid blocking airflow around the device. Also, consider thermal interface materials to improve heat transfer.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins of the ADG702BRMZ. Also, follow proper handling and storage procedures to prevent ESD damage.
  • The ADG702BRMZ requires a specific power sequencing to prevent latch-up or damage. Ensure that the analog supply (VDDA) is powered up before the digital supply (VDDD), and that the digital supply is powered down before the analog supply.

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ADG702BRMZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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