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ADG704BRMZ-REEL7 - Analog Devices

Description: +1.8 V to +5.5 V Single Supply 2.5 V (Typ) On Resistance Low On-Resistance Flatness –3 dB Bandwidth >200 MHz Rail-to-Rail Operation 10-Lead mSOIC Package Fast Switching Times tON 20 ns tOFF 13 ns Typical Power Consumption (<0.01 mW) TTL/CMOS Compatible

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ADG704BRMZ-REEL7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RM-10..
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ADG704BRMZ-REEL7 Details

  • Manufacturer Part Number:

    ADG704BRMZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    MICRO, SOIC-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    RM-10

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    CAN ALSO OPERATE WITH 5 V SUPPLY

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    60 dB

  • On-state Resistance Match-Nom:

    0.1 Ω

  • On-state Resistance-Max (Ron):

    8 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.03 A

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    16 ns

  • Switch-on Time-Max:

    24 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ADG704BRMZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG704BRMZ-REEL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliability in high-temperature applications, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, it's recommended to derate the device's power consumption and operating frequency at high temperatures.
  • To prevent ESD damage, it's recommended to handle the ADG704BRMZ-REEL7 in an ESD-controlled environment, wear an ESD wrist strap or use an ESD mat, and use ESD-protected packaging and storage materials. Additionally, it's essential to follow proper grounding and handling procedures when handling the device.
  • The ADG704BRMZ-REEL7 is not a radiation-hardened device, and it's not recommended for use in radiation-intensive applications. If radiation hardness is required, it's recommended to use a radiation-hardened equivalent device or to consult with Analog Devices Inc. for custom radiation-hardened solutions.
  • For the ADG704BRMZ-REEL7, it's recommended to use a soldering iron with a temperature range of 250°C to 260°C, and to use a solder with a melting point of 217°C to 220°C. It's also recommended to use a rework station with a hot air gun and a vacuum pickup tool for rework and repair operations.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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