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ADG772BCPZ-1REEL - Analog Devices

Description: Multiplexer Switch ICs 12 ld 3x3 LFCSP, 3v dual SPDT, Univ USB

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ADG772BCPZ-1REEL - Analog Devices - PCB symbol
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PCB Footprints
ADG772BCPZ-1REEL - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 12-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body and 0.75 mm Package Height (CP-12-4)
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3D Models
ADG772BCPZ-1REEL - Analog Devices - 3D model - Quad Flat No-Lead - 12-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body and 0.75 mm Package Height (CP-12-4)
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ADG772BCPZ-1REEL Details

  • Manufacturer Part Number:

    ADG772BCPZ-1REEL

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    3 X 3 MM, ROHS COMPLIANT, MO-220VEED-1, LFCSP-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    CP-12-4

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    S-XQCC-N12

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    12

  • Off-state Isolation-Nom:

    73 dB

  • On-state Resistance Match-Nom:

    0.04 Ω

  • On-state Resistance-Max (Ron):

    8.8 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC12,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Signal Current-Max:

    0.035 A

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    9.5 ns

  • Switch-on Time-Max:

    12.5 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    3 mm

ADG772BCPZ-1REEL Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG772BCPZ-1REEL should include a solid ground plane, decoupling capacitors close to the device, and a thermal pad connected to a heat sink or a thermal relief pattern. The device should be placed away from high-frequency signals and noise sources.
  • To ensure reliability in high-temperature applications, it is essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and keeping the device within its recommended operating temperature range.
  • When selecting external components for the ADG772BCPZ-1REEL, consider the component's voltage rating, current handling, and power dissipation. Ensure that the components are compatible with the device's operating frequency and can handle the required signal levels.
  • To troubleshoot issues with the ADG772BCPZ-1REEL, start by verifying the device's input voltage, output voltage, and current consumption. Check for proper PCB layout, decoupling, and thermal management. Use oscilloscopes and current probes to measure signals and currents. Consult the datasheet and application notes for guidance.
  • The ADG772BCPZ-1REEL's power-on reset (POR) circuit ensures that the device resets correctly during power-up. System designers should ensure that the POR circuit is properly connected and that the device is powered up slowly to prevent latch-up or incorrect reset.

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ADG772BCPZ-1REEL Overview

Use the download button to access the ADG772BCPZ-1REEL schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ADG77, or try a keyword search, such as Multiplexers or Switches

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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