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ADG811YCPZ-REEL7 - Analog Devices

Description: Analog Switch ICs 500mOhm 3.6V CMOS Quad SPST

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PCB Footprints
ADG811YCPZ-REEL7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-16-2 (LFCSP)
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3D Models
ADG811YCPZ-REEL7 - Analog Devices  - 3D model - Quad Flat No-Lead - CP-16-2 (LFCSP)
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ADG811YCPZ-REEL7 Details

  • Manufacturer Part Number:

    ADG811YCPZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    LFCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CP-16-21

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Normal Position:

    NC

  • Number of Channels:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    67 dB

  • On-state Resistance Match-Nom:

    0.04 Ω

  • On-state Resistance-Max (Ron):

    0.72 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Signal Current-Max:

    0.3 A

  • Supply Current-Max (Isup):

    0.004 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    8 ns

  • Switch-on Time-Max:

    30 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ADG811YCPZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG811YCPZ-REEL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliability in high-temperature applications, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive material for the PCB, and ensuring good airflow around the device. Additionally, it's recommended to derate the device's power consumption and operating frequency at high temperatures.
  • The ADG811YCPZ-REEL7 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding oneself before handling the device, and using ESD-protective packaging and storage.
  • The ADG811YCPZ-REEL7 is not specifically designed for radiation-hardened applications. If radiation hardness is required, it's recommended to consult with Analog Devices Inc. or a qualified radiation effects engineer to determine the device's suitability for the specific application.
  • For soldering and rework, it's recommended to follow the guidelines outlined in the JEDEC J-STD-020 standard. This includes using a soldering iron with a temperature range of 350°C to 370°C, and using a solder with a melting point above 217°C. Additionally, it's recommended to use a rework station with a controlled temperature profile and a gentle air flow.

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ADG811YCPZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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