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ADG811YRU-REEL7 - Analog Devices

Description: IC SWITCH QUAD SPST 16TSSOP

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ADG811YRU-REEL7 - Analog Devices - PCB symbol
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ADG811YRU-REEL7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RU-16 (TSSOP)--
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ADG811YRU-REEL7 - Analog Devices - 3D model - Small Outline Packages - RU-16 (TSSOP)--
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ADG811YRU-REEL7 Details

  • Manufacturer Part Number:

    ADG811YRU-REEL7

  • Source Url Status Check Date:

    2013-05-01 14:56:38.485

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    MO-153AB, TSSOP-16

  • Pin Count:

    16

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e0

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NC

  • Number of Channels:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    67 dB

  • On-state Resistance Match-Nom:

    0.04 Ω

  • On-state Resistance-Max (Ron):

    0.72 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    240

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Signal Current-Max:

    0.3 A

  • Supply Current-Max (Isup):

    0.004 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    8 ns

  • Switch-on Time-Max:

    30 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

ADG811YRU-REEL7 Frequently Asked Questions (FAQs)

  • Analog Devices provides a recommended PCB layout in the datasheet, but it's essential to follow good layout practices, such as minimizing trace lengths, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, consider using a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The ADG811YRU-REEL7 requires a single 1.8 V to 5.5 V power supply. Ensure the power supply is clean and well-regulated, and use a 0.1 μF decoupling capacitor between the VDD pin and the GND pin. Additionally, consider using a voltage regulator or a low-dropout regulator (LDO) to provide a stable voltage supply.
  • The ADG811YRU-REEL7 can operate at frequencies up to 200 MHz. However, the actual frequency of operation depends on the specific application, PCB layout, and signal integrity. It's essential to evaluate the device's performance in your specific application and consider factors such as signal attenuation, jitter, and noise.
  • The ADG811YRU-REEL7 has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. Additionally, consider adding external ESD protection devices, such as TVS diodes or ESD arrays, to further protect the device.
  • The ADG811YRU-REEL7 has a maximum junction temperature of 150°C. Ensure good thermal management by providing adequate heat dissipation, such as using a heat sink or a thermal pad, and keeping the device away from heat sources. Additionally, consider using thermal interface materials, such as thermal tape or thermal grease, to improve heat transfer.

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ADG811YRU-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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