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ADG854BCPZ-REEL7 - Analog Devices

Description: ANALOG DEVICES - ADG854BCPZ-REEL7. - ANALOGUE SWITCH, 2:1 MUX, DUAL, SPDT, LFCSP-10

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ADG854BCPZ-REEL7 - Analog Devices - PCB symbol
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PCB Footprints
ADG854BCPZ-REEL7 - Analog Devices PCB footprint - Other - Other - 10-Lead Lead Frame Chip Scale Package [LFCSP_UQ] 1.30 x 1.60 mm Body, Ultra Thin Quad. (CP-10-10)
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3D Models
ADG854BCPZ-REEL7 - Analog Devices - 3D model - Other - 10-Lead Lead Frame Chip Scale Package [LFCSP_UQ] 1.30 x 1.60 mm Body, Ultra Thin Quad. (CP-10-10)
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ADG854BCPZ-REEL7 Details

  • Manufacturer Part Number:

    ADG854BCPZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    1.30 X 1.60 MM, ROHS COMPLIANT, LFCSP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    CP-10-10

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-XQCC-N10

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    75 dB

  • On-state Resistance Match-Nom:

    0.03 Ω

  • On-state Resistance-Max (Ron):

    1.5 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC10,.05X.06,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.6 mm

  • Signal Current-Max:

    0.3 A

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    8 ns

  • Switch-on Time-Max:

    43 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    1.3 mm

ADG854BCPZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG854BCPZ-REEL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliability in high-temperature applications, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow. Additionally, it's recommended to derate the device's power consumption and operating frequency to prevent overheating.
  • The ADG854BCPZ-REEL7 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding oneself before handling the device, and using ESD-protective packaging.
  • The ADG854BCPZ-REEL7 is not specifically designed for radiation-hardened applications. If radiation hardness is required, it's recommended to consult with Analog Devices Inc. or a qualified radiation effects engineer to determine the suitability of the device for the specific application.
  • For soldering and rework, it's recommended to follow the guidelines outlined in the JEDEC J-STD-020 standard. This includes using a soldering iron with a temperature range of 350°F to 380°F (175°C to 193°C), and using a solder with a melting point above 180°C.

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ADG854BCPZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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