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ADG919BCPZ-REEL7 - Analog Devices

Description: Wideband 4 GHz, 43 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, 2:1 Mux/SPDT

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ADG919BCPZ-REEL7 - Analog Devices - PCB symbol
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ADG919BCPZ-REEL7 - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - 8-Lead Lead Frame Chip Scale Package [LFCSP]-ren1
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ADG919BCPZ-REEL7 - Analog Devices - 3D model - Small Outline No-lead - 8-Lead Lead Frame Chip Scale Package [LFCSP]-ren1
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ADG919BCPZ-REEL7 Details

  • Manufacturer Part Number:

    ADG919BCPZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    3 X 3 MM, ROHS COMPLIANT, CP-8-2, LFCSP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    CP-8-13

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • 1dB Compression Point:

    17 dBm

  • Additional Feature:

    CMOS COMPATIBLE

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Input Power-Max (CW):

    17.99 dBm

  • Insertion Loss-Max:

    1.25 dB

  • Isolation-Min:

    36 dB

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • On Time-Nom:

    0.0066 µs

  • Operating Frequency-Max:

    4000 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOLCC8,.1,20

  • Port Termination:

    REFLECTIVE

  • Power Supplies:

    1.65/2.75 V

  • RF/Microwave Device Type:

    DIVERSITY SWITCH

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • VSWR-Max:

    1.09

ADG919BCPZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG919BCPZ-REEL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliability in high-temperature applications, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, it's recommended to derate the device's power consumption and operating frequency to prevent overheating.
  • The ADG919BCPZ-REEL7 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding oneself before handling the device, and using ESD-protective packaging.
  • The ADG919BCPZ-REEL7 is not specifically designed for radiation-hardened applications. However, Analog Devices Inc. offers other products that are designed for radiation-hardened applications. It's recommended to consult with Analog Devices Inc. or a qualified radiation effects engineer to determine the suitability of the ADG919BCPZ-REEL7 or alternative products for radiation-hardened applications.
  • The ADG919BCPZ-REEL7 should be stored in a cool, dry place, away from direct sunlight and moisture. It's recommended to store the device in its original packaging or in a moisture-proof bag with desiccant. Handling should be done with ESD-safe materials and grounding oneself before handling the device.

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ADG919BCPZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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