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ADGS1212BCPZ - Analog Devices

Description: Analog Switch ICs SPI Low charge injection

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ADGS1212BCPZ - Analog Devices - PCB symbol
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PCB Footprints
ADGS1212BCPZ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-24-15
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3D Models
ADGS1212BCPZ - Analog Devices - 3D model - Quad Flat No-Lead - CP-24-15
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ADGS1212BCPZ Details

  • Manufacturer Part Number:

    ADGS1212BCPZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    CP-24-15

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2017-09-07

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Additional Feature:

    ALSO HAS LOGIC POWER SUPPLY= 2.7V TO 5.5V

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    S-XQCC-N24

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Max (Vsup):

    -16.5 V

  • Neg Supply Voltage-Min (Vsup):

    -4.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    24

  • Off-state Isolation-Nom:

    80 dB

  • On-state Resistance Match-Nom:

    2.5 Ω

  • On-state Resistance-Max (Ron):

    190 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Signal Current-Max:

    0.02 A

  • Supply Current-Max (Isup):

    0.44 mA

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    205 ns

  • Switch-on Time-Max:

    450 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

ADGS1212BCPZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADGS1212BCPZ involves keeping the signal traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended. Additionally, the device's exposed pad should be connected to a solid ground plane to improve thermal performance and reduce electrical noise.
  • The ADGS1212BCPZ requires a single 3.3V or 5V power supply. It's recommended to power the device from a clean, low-noise power source. Power sequencing is not critical, but it's recommended to power the device after the power supply has stabilized. A soft-start power-up sequence can help reduce inrush current and prevent latch-up.
  • The maximum switching frequency of the ADGS1212BCPZ is 100 kHz. The power consumption of the device increases with switching frequency, so it's recommended to minimize the switching frequency to reduce power consumption and heat generation. However, the device can operate at higher frequencies with proper thermal management and power supply design.
  • The ADGS1212BCPZ has built-in ESD protection, but additional protection measures can be taken to ensure the device's reliability. These include using ESD protection diodes, TVS diodes, or surge protectors on the input and output lines, as well as following proper handling and storage procedures to prevent ESD damage.
  • The ADGS1212BCPZ has a maximum junction temperature of 125°C. To ensure reliable operation, it's recommended to keep the device's junction temperature below 100°C. This can be achieved through proper PCB design, thermal vias, and heat sinks. The device's thermal performance can be improved by connecting the exposed pad to a solid ground plane and using thermal interface materials.

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ADGS1212BCPZ Overview

Use the download button to access the ADGS1212BCPZ schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ADGS1, or try a keyword search, such as Multiplexers or Switches

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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