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ADGS1412BCPZ-RL7 - Analog Devices

Description: SPI Interface, 1.5 Ω RON, ±15 V/+12 V, Quad SPST Switch, Mux Configurable

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ADGS1412BCPZ-RL7 - Analog Devices - PCB symbol
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PCB Footprints
ADGS1412BCPZ-RL7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-24-17
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3D Models
ADGS1412BCPZ-RL7 - Analog Devices - 3D model - Quad Flat No-Lead - CP-24-17
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ADGS1412BCPZ-RL7 Details

  • Manufacturer Part Number:

    ADGS1412BCPZ-RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    CP-24-17

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2016-10-27

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    S-XQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Max (Vsup):

    -16.5 V

  • Neg Supply Voltage-Min (Vsup):

    -4.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Channels:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    24

  • Off-state Isolation-Nom:

    76 dB

  • On-state Resistance Match-Nom:

    0.13 Ω

  • On-state Resistance-Max (Ron):

    4 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Signal Current-Max:

    0.297 A

  • Supply Current-Max (Isup):

    0.38 mA

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    225 ns

  • Switch-on Time-Max:

    485 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

ADGS1412BCPZ-RL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADGS1412BCPZ-RL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliability in high-temperature applications, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive material for the PCB, and ensuring good airflow around the device. Additionally, it's recommended to derate the device's power consumption and operating frequency at high temperatures.
  • The ADGS1412BCPZ-RL7 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. It's recommended to use an ESD wrist strap or mat, and to handle the device by the body rather than the pins. Additionally, it's a good idea to use ESD-protected storage and shipping materials.
  • To troubleshoot issues with the ADGS1412BCPZ-RL7, start by reviewing the datasheet and application notes to ensure that the device is being used within its specified operating conditions. Next, use a logic analyzer or oscilloscope to capture and analyze the device's signals. It's also recommended to check the power supply and clock signals for noise and jitter.
  • The ADGS1412BCPZ-RL7 is a radiation-hardened device, but it's still important to consider radiation tolerance and latch-up when designing systems for high-reliability applications. It's recommended to follow industry-standard radiation testing and qualification procedures, and to use radiation-hardened components and design techniques.

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ADGS1412BCPZ-RL7 Overview

Use the download button to access the ADGS1412BCPZ-RL7 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ADGS1, or try a keyword search, such as Multiplexers or Switches

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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