ADIS16505-2BMLZ footprint, schematic symbol and 3D model by Analog Devices

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PCB Footprints

ADIS16505-2BMLZ - Analog Devices PCB footprint - BGA - BGA - 100-Ball Ball Grid Array Module [BGA] (ML-100-1)

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3D Models

ADIS16505-2BMLZ - Analog Devices - 3D model - BGA - 100-Ball Ball Grid Array Module [BGA] (ML-100-1)

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Datasheet Download Datasheet
Stock & Prices Price & Stock for ADIS16505-2BMLZ
Part Number ADIS16505-2BMLZ
Manufacturer Analog Devices
Pin Count 100
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 100-Ball Ball Grid Array Module [BGA] (ML-100-1)
Released Date Dec 31, 2019
Last Modified Date Nov 8, 2024 11:10 AM UTC
Pinout / Pin List Click Here (Member Only)

ADIS16505-2BMLZ Details

Manufacturer Part Number:
ADIS16505-2BMLZ
Brand Name:
Analog Devices Inc
Pbfree Code:
No
Rohs Code:
Yes
Part Life Cycle Code:
Active
Pin Count:
100
Manufacturer Package Code:
ML-100-1
ECCN Code:
7A994
HTS Code:
8542.39.00.01
Date Of Intro:
2019-10-29
Manufacturer:
Analog Devices Inc
YTEOL:
8.5
Analog IC - Other Type:
ANALOG CIRCUIT
JESD-30 Code:
S-PBGA-B100
Length:
15 mm
Moisture Sensitivity Level:
5
Number of Functions:
1
Number of Terminals:
100
Operating Temperature-Max:
105 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
BGA
Package Equivalence Code:
BGA100,10X10,50
Package Shape:
SQUARE
Package Style:
GRID ARRAY
Seated Height-Max:
6.077 mm
Supply Voltage-Max (Vsup):
3.6 V
Supply Voltage-Min (Vsup):
3 V
Supply Voltage-Nom (Vsup):
3.3 V
Surface Mount:
YES
Temperature Grade:
INDUSTRIAL
Terminal Form:
BALL
Terminal Pitch:
1.27 mm
Terminal Position:
BOTTOM
Width:
15 mm

ADIS16505-2BMLZ Frequently Asked Questions (FAQs)

The recommended power-up sequence is to apply VDD first, followed by VIO, and then the clock signal. This ensures proper initialization of the device.
The SPI interface can be configured by setting the CS pin low, sending the command byte, and then sending or receiving data bytes. The SPI clock frequency should be between 100 kHz and 2 MHz.
The internal temperature sensor is used for internal compensation and calibration. The temperature data can be accessed through the TEMP_OUT register (Address 0x1F).
Calibration involves performing a self-test, followed by a gyro bias calibration, and then a accelerometer bias calibration. Refer to the datasheet for the specific calibration procedure.
The maximum allowable vibration amplitude is 10,000 g's. Exceeding this limit may cause damage to the device.

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ADIS16505-2BMLZ Overview

Use the download button to access the ADIS16505-2BMLZ schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like ADIS1, or try a keyword search, such as Other Signal Circuits

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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ADIS16505-2BMLZ - Analog Devices

ADIS16505-2BMLZ Details

ADIS16505-2BMLZ Frequently Asked Questions (FAQs)

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