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ADL5304ACPZ-R2 - Analog Devices

Description: High Speed, 200 dB Range, Current to Voltage Logarithmic Converter

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ADL5304ACPZ-R2 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - .32-Lead Lead Frame Chip Scale Package [LFCSP]+
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ADL5304ACPZ-R2 Details

  • Manufacturer Part Number:

    ADL5304ACPZ-R2

  • Source Url Status Check Date:

    2013-05-01 14:56:39.142

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    LFCSP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    CP-32-8

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    17 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

ADL5304ACPZ-R2 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADL5304ACPZ-R2 involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper biasing, make sure to connect the VPOS pin to a stable voltage source between 4.5V and 5.5V, and the VNEG pin to a stable voltage source between -4.5V and -5.5V. Also, ensure that the input common-mode voltage is within the recommended range of 1.5V to 3.5V.
  • The maximum power dissipation of the ADL5304ACPZ-R2 is 1.4W, which is calculated based on the maximum junction temperature of 150°C and the thermal resistance of the package. Make sure to provide adequate heat sinking and thermal management to prevent overheating.
  • The ADL5304ACPZ-R2 is specified to operate from -40°C to 125°C, but its performance may degrade at high temperatures. If you need to operate the device in a high-temperature environment, make sure to derate the power dissipation and consider using a heat sink or thermal management system.
  • Common issues with the ADL5304ACPZ-R2 can often be traced back to poor PCB layout, inadequate decoupling, or incorrect biasing. Check the PCB layout for any signs of resonance or oscillation, ensure that decoupling capacitors are properly placed, and verify that the biasing is correct. Also, check for any signs of overheating or thermal issues.

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ADL5304ACPZ-R2 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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