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ADM1062ACPZ-REEL7 - Analog Devices

Description: Super Sequencer® with Margining Control and Temperature Monitoring

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ADM1062ACPZ-REEL7 - Analog Devices - PCB symbol
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PCB Footprints
ADM1062ACPZ-REEL7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-40-9
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3D Models
ADM1062ACPZ-REEL7 - Analog Devices - 3D model - Quad Flat No-Lead - CP-40-9
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ADM1062ACPZ-REEL7 Details

  • Manufacturer Part Number:

    ADM1062ACPZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    LFCSP-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    CP-40-9

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    POWER SEQUENCER

  • JESD-30 Code:

    S-XQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    6 mA

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    6 mm

ADM1062ACPZ-REEL7 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device's thermal pad should be connected to the ground plane using multiple thermal vias.
  • Ensure that the device is operated within the recommended operating conditions, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material between the device and the heat sink.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It is essential to ensure that the device operates within the recommended temperature range.
  • Check the power supply voltage, ensure that the POR pin is properly connected, and verify that the reset signal is properly generated. Also, review the system's power-up sequence to ensure that the device is properly initialized.
  • Ensure that the power supply provides a stable voltage within the recommended range, and that it can supply the required current. Also, consider using a low-dropout regulator (LDO) to minimize voltage drops and ensure reliable operation.

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ADM1062ACPZ-REEL7 Overview

Use the download button to access the ADM1062ACPZ-REEL7 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ADM10, or try a keyword search, such as Power Management Circuits

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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