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ADM1293-1AACPZ - Analog Devices

Description: Analog Devices ADM1293-1AACPZ, Current Sensor, 16-Pin, LFCSP

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ADM1293-1AACPZ - Analog Devices - PCB symbol
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PCB Footprints
ADM1293-1AACPZ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
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3D Models
ADM1293-1AACPZ - Analog Devices - 3D model - Quad Flat No-Lead - 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
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ADM1293-1AACPZ Details

  • Manufacturer Part Number:

    ADM1293-1AACPZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    4 X 4 MM, ROHS COMPLIANT, MO-220WGGC, LFCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CP-16-17

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    3.3 mA

  • Supply Voltage-Max (Vsup):

    20 V

  • Supply Voltage-Min (Vsup):

    2.95 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

ADM1293-1AACPZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADM1293-1AACPZ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog layer to minimize noise and crosstalk.
  • The ADM1293-1AACPZ requires a single 3.3V power supply, and it's recommended to use a low-dropout linear regulator (LDO) to power the device. The power sequencing requirement is to power up the device after the power supply has stabilized, and to ensure that the power supply is clean and free of noise.
  • The recommended clock frequency for the ADM1293-1AACPZ is 10 MHz to 40 MHz, and it's recommended to use a high-quality clock source such as a crystal oscillator or a phase-locked loop (PLL) to ensure a stable clock signal.
  • The ADM1293-1AACPZ has several configuration options that can be set through the SPI interface. It's recommended to consult the datasheet and application notes to determine the optimal configuration for your specific application, and to use the Analog Devices evaluation board and software development kit (SDK) to simplify the configuration process.
  • The ADM1293-1AACPZ has a maximum junction temperature of 150°C, and it's recommended to ensure good thermal conductivity between the device and the PCB. Additionally, it's recommended to use thermal simulation tools to ensure that the device operates within the recommended temperature range, and to consider using thermal management techniques such as heat sinks or thermal interfaces.

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ADM1293-1AACPZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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