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ADM1490EBRZ - Analog Devices

Description: Analog Devices ADM1490EBRZ, Line Transceiver, TIA/EIA-485-A-98, 5 V, 8-Pin SOIC

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ADM1490EBRZ - Analog Devices PCB footprint - Other - Other - SOIC127P600X175-8N
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ADM1490EBRZ - Analog Devices  - 3D model - Other - SOIC127P600X175-8N
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ADM1490EBRZ Details

  • Manufacturer Part Number:

    ADM1490EBRZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, MS-012AA, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    R-8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Low Current-Max:

    0.004 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    20 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    2 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    17 ns

  • Width:

    3.9 mm

ADM1490EBRZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADM1490EBRZ involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the device close to the power supply. Additionally, using a shielded enclosure and minimizing the number of vias can help reduce EMI.
  • To ensure proper powering and decoupling of the ADM1490EBRZ, use a low-ESR capacitor (e.g., 10uF) between the VCC and GND pins, and a 0.1uF capacitor between the VCC and AVCC pins. Also, use a 1uF capacitor between the VCC and GND pins for each supply pin.
  • The ADM1490EBRZ can achieve data rates of up to 100 Mbps, but the actual data rate may be limited by the system's clock frequency, signal integrity, and PCB layout.
  • To troubleshoot issues with the ADM1490EBRZ, check the power supply voltage, clock frequency, and signal integrity. Verify that the device is properly configured and that the transmit and receive lines are properly terminated. Use an oscilloscope to analyze the signal waveforms and check for noise, jitter, or other anomalies.
  • Yes, the ADM1490EBRZ can be used in a hot-swap application, but it requires proper power sequencing and voltage ramp-up to prevent damage to the device. A power-on reset circuit can be used to ensure a clean power-up sequence.

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ADM1490EBRZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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