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ADM3312EARUZ - Analog Devices

Description: ADM3312EARUZ, Line Transceiver, EIA-232, EIA-232-E, RS-232 3-TX 3-RX 3-TRX, 3.3V, 24-Pin TSSOP

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ADM3312EARUZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RU-24 (TSSOP)
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ADM3312EARUZ - Analog Devices  - 3D model - Small Outline Packages - RU-24 (TSSOP)
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ADM3312EARUZ Details

  • Manufacturer Part Number:

    ADM3312EARUZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    ROHS COMPLIANT, MO-153AD, TSSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    RU-24

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Differential Output:

    NO

  • Driver Number of Bits:

    3

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    7.8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    3

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    10 V

  • Output Low Current-Max:

    0.0016 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    1000 ns

  • Receiver Number of Bits:

    3

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    35 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    2.7 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

ADM3312EARUZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate analog ground plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a low-ESR capacitor for decoupling and place it close to the device.
  • Use a high-quality input capacitor with low ESR, and ensure the input voltage is within the recommended range. Also, use a low-dropout linear regulator (LDO) or a switching regulator with a high power supply rejection ratio (PSRR) to minimize noise and ripple.
  • The maximum output current capability of the ADM3312EARUZ is 1.5A. However, it's recommended to derate the output current to 1.2A for reliable operation and to prevent overheating.
  • Use a voltage supervisor or a reset IC to monitor the input voltage and reset the device if it falls outside the recommended range. You can also use a voltage clamp or a TVS diode to protect the device from overvoltage conditions.
  • The thermal impedance of the ADM3312EARUZ package is typically around 25°C/W. This means that for every watt of power dissipation, the junction temperature will rise by 25°C above the ambient temperature.

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ADM3312EARUZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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