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ADM6326-29ARTZ-R7 - Analog Devices

Description: Microprocessor Reset Circuits

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ADM6326-29ARTZ-R7 - Analog Devices - PCB symbol
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ADM6326-29ARTZ-R7 - Analog Devices PCB footprint - Other - Other - SOT95P237X112-3N
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ADM6326-29ARTZ-R7 - Analog Devices - 3D model - Other - SOT95P237X112-3N
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ADM6326-29ARTZ-R7 Details

  • Manufacturer Part Number:

    ADM6326-29ARTZ-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    RT-3

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.00175 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.96 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.93V

  • Width:

    1.3 mm

ADM6326-29ARTZ-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADM6326-29ARTZ-R7 involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and ensure optimal performance.
  • To ensure proper decoupling, place a 10uF ceramic capacitor between the VIN pin and the GND pin, and a 1uF ceramic capacitor between the VOUT pin and the GND pin. Additionally, use a 10nF ceramic capacitor between the VIN pin and the VIN pin to filter out high-frequency noise.
  • The ADM6326-29ARTZ-R7 is rated for operation from -40°C to +125°C, but the maximum ambient temperature range for reliable operation is typically considered to be -20°C to +85°C.
  • Yes, the ADM6326-29ARTZ-R7 is qualified for automotive and high-reliability applications, and meets the requirements of the AEC-Q100 standard. However, it's essential to follow the recommended PCB layout, decoupling, and thermal management guidelines to ensure reliable operation in these applications.
  • To troubleshoot issues with the ADM6326-29ARTZ-R7, start by verifying the input voltage, output voltage, and output current. Check for proper decoupling, PCB layout, and thermal management. Use an oscilloscope to measure the output voltage and current, and check for signs of oscillation or noise. Consult the datasheet and application notes for guidance on troubleshooting and optimization.

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ADM6326-29ARTZ-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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