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ADM6339OARJZ-RL7 - Analog Devices

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ADM6339OARJZ-RL7 - Analog Devices PCB footprint - Other - Other - SOT95P280X145-6N
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ADM6339OARJZ-RL7 - Analog Devices  - 3D model - Other - SOT95P280X145-6N
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ADM6339OARJZ-RL7 Details

  • Manufacturer Part Number:

    ADM6339OARJZ-RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, MO-178AB, SOT-23, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    RJ-6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max (Isup):

    0.115 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    -5,+1.23,3.3,5V

  • Width:

    1.6 mm

ADM6339OARJZ-RL7 Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 4-layer PCB with a solid ground plane on the bottom layer, and to place thermal vias under the package to dissipate heat efficiently. Additionally, keeping the PCB traces away from the package and using a thermal pad on the top layer can help to reduce thermal resistance.
  • To ensure reliable operation in high-vibration environments, it is recommended to use a secure mounting method, such as screwing the device to the PCB or using a robust adhesive. Additionally, using a conformal coating and potting the device can help to protect it from vibration-induced damage.
  • The recommended input capacitor is a 10uF ceramic capacitor with a voltage rating of 10V or higher, and the recommended output capacitor is a 22uF ceramic capacitor with a voltage rating of 10V or higher. These capacitors should be placed as close to the device as possible to minimize noise and ensure stable operation.
  • To troubleshoot issues with the device's output voltage, first check the input voltage and ensure it is within the recommended range. Next, verify that the output capacitor is properly connected and of the recommended value. If the issue persists, check for any signs of overheating or excessive current draw, and ensure that the device is properly soldered to the PCB.
  • The recommended soldering profile for the ADM6339OARJZ-RL7 is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. It is also recommended to use a soldering iron with a temperature range of 350-400°F (175-200°C) and to avoid applying excessive force or pressure to the device during soldering.

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ADM6339OARJZ-RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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