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ADM8611N263ACBZ-R7 - Analog Devices

Description: ANALOG DEVICES - ADM8611N263ACBZ-R7 - VOLTAGE SUPERVISOR, 5.5V, WLCSP-6

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ADM8611N263ACBZ-R7 - Analog Devices PCB footprint - BGA - BGA - 6-Ball Wafer Level Chip Scale Package [WLCSP]-
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ADM8611N263ACBZ-R7 - Analog Devices  - 3D model - BGA - 6-Ball Wafer Level Chip Scale Package [WLCSP]-
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ADM8611N263ACBZ-R7 Details

  • Manufacturer Part Number:

    ADM8611N263ACBZ-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    6

  • Manufacturer Package Code:

    CB-6-17

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:Y;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-XBGA-B6

  • JESD-609 Code:

    e1

  • Length:

    1.46 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.66 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    0.9 V

  • Supply Voltage-Nom (Vsup):

    2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.96 mm

ADM8611N263ACBZ-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADM8611N involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper power-up and power-down of the ADM8611N, it is recommended to follow a sequential power-up sequence, where the input voltage is applied before the enable pin is asserted. During power-down, the enable pin should be de-asserted before the input voltage is removed.
  • The recommended input capacitance for the ADM8611N is 10uF to 22uF, and the recommended output capacitance is 10uF to 47uF. The exact capacitance values may vary depending on the specific application and operating conditions.
  • The ADM8611N has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the thermal plane.
  • The ADM8611N has internal ESD protection, but additional external ESD protection may be necessary depending on the application. A TVS (transient voltage suppressor) diode or a zener diode can be used to provide additional ESD protection.

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ADM8611N263ACBZ-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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