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ADN4661BRZ - Analog Devices

Description: ADN4661BRZ, Differential Line Driver 8-Pin SOIC N

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ADN4661BRZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - R8
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ADN4661BRZ - Analog Devices  - 3D model - Small Outline Packages - R8
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ADN4661BRZ Details

  • Manufacturer Part Number:

    ADN4661BRZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, MS-012AA, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    R-8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.25 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1.5 ns

  • Width:

    3.9 mm

ADN4661BRZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADN4661BRZ involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the signal source. Additionally, it's recommended to use a low-ESR capacitor for the VCC bypass capacitor.
  • To ensure proper termination, use a 50-ohm termination resistor in series with the output, and a 50-ohm load resistor to ground. This will help maintain signal integrity and reduce reflections.
  • The maximum cable length supported by the ADN4661BRZ depends on the specific application and signal frequency. As a general guideline, the device can support cable lengths up to 10 meters at data rates up to 3.2 Gbps. However, it's recommended to consult with Analog Devices' application engineers for specific guidance on cable length and signal integrity.
  • Yes, the ADN4661BRZ can be used in a redundant or redundant-backup configuration. This involves using multiple devices in parallel, with each device connected to a separate signal source. This configuration can provide increased reliability and fault tolerance in critical systems.
  • The ADN4661BRZ has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking and airflow to keep the device within its recommended operating temperature range. A thermal pad or heat sink can be used to dissipate heat, and the device should be placed in a well-ventilated area.

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ADN4661BRZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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