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ADN4663BRZ - Analog Devices

Description: Dual, 3 V, CMOS, LVDS High Speed Differential Driver

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ADN4663BRZ - Analog Devices - PCB symbol
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ADN4663BRZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - soic-n-2
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ADN4663BRZ - Analog Devices - 3D model - Small Outline Packages - soic-n-2
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ADN4663BRZ Details

  • Manufacturer Part Number:

    ADN4663BRZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, MS-012-AA, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    R-8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Differential Output:

    YES

  • Driver Number of Bits:

    2

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    1.5 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1.5 ns

  • Width:

    3.9 mm

ADN4663BRZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADN4663BRZ involves keeping the input and output traces short and symmetrical, using a solid ground plane, and minimizing the distance between the device and the load. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable 3.3V or 5V power supply, and the GND pin to a solid ground plane. The input voltage (VIN) should be within the recommended range of 2.7V to 5.5V. Additionally, decouple the power supply with a 0.1uF capacitor.
  • The ADN4663BRZ can support data rates up to 100 Mbps, but the actual achievable data rate depends on the specific application, PCB layout, and signal integrity. For high-speed applications, it's recommended to use a 100-ohm differential transmission line and to follow the recommended PCB layout guidelines.
  • To troubleshoot issues with the ADN4663BRZ, use an oscilloscope to verify the signal integrity and check for signal reflections, ringing, or distortion. Also, verify the power supply voltage, decoupling, and PCB layout. If issues persist, consult the datasheet and application notes or contact Analog Devices' technical support.
  • The ADN4663BRZ is rated for operation from -40°C to 85°C. While it can operate in high-temperature environments, it's essential to ensure proper thermal management and follow the recommended PCB layout guidelines to minimize thermal resistance. Consult the datasheet for specific thermal characteristics and derating information.

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ADN4663BRZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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