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ADN4666ARUZ-REEL7 - Analog Devices

Description: Analog Devices Inc.3.3 V power supply temperature range of −40°C to +85°C 0/4 Receiver LVDS 16-TSSOP

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ADN4666ARUZ-REEL7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RU-16
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ADN4666ARUZ-REEL7 Details

  • Manufacturer Part Number:

    ADN4666ARUZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    ROHS COMPLIANT, MO153-AB, TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    RU-16

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Low Current-Max:

    0.002 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    3.3 ns

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

ADN4666ARUZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADN4666ARUZ-REEL7 involves keeping the signal paths short, using a solid ground plane, and minimizing noise coupling. It's recommended to follow Analog Devices' application notes and layout guidelines for optimal performance.
  • To ensure the ADN4666ARUZ-REEL7 operates within its recommended operating conditions, verify that the supply voltage, temperature, and input/output signals are within the specified ranges. Also, ensure proper thermal management and decoupling to prevent overheating and noise issues.
  • To mitigate EMI and RFI when using the ADN4666ARUZ-REEL7, use proper shielding, grounding, and filtering techniques. Ensure that the device is placed in a shielded area, and use EMI filters or common-mode chokes to reduce emissions.
  • To troubleshoot issues with the ADN4666ARUZ-REEL7, start by verifying the power supply and input/output signals. Check for proper connections, soldering, and component placement. Use oscilloscopes or logic analyzers to debug the issue, and consult Analog Devices' application notes and support resources if needed.
  • The ADN4666ARUZ-REEL7 adheres to Analog Devices' quality and reliability standards, which include compliance with industry standards such as ISO 9001, IATF 16949, and AEC-Q100. The device is also built with high-reliability materials and manufacturing processes to ensure long-term performance and durability.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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