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ADP1052ACPZ-R7 - Analog Devices

Description: Digital Controller for Isolated Power Supply with PMBus Interface

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PCB Footprints
ADP1052ACPZ-R7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-24-15__
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3D Models
ADP1052ACPZ-R7 - Analog Devices  - 3D model - Quad Flat No-Lead - CP-24-15__
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ADP1052ACPZ-R7 Details

  • Manufacturer Part Number:

    ADP1052ACPZ-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    CP-24-15

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    DIGITAL POWER CONTROLLER

  • JESD-30 Code:

    S-XQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.1 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +2.85V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

ADP1052ACPZ-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADP1052ACPZ-R7 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to use a separate analog ground plane and to keep the digital and analog signals separate to minimize noise and interference.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, the output capacitors should be chosen to ensure that the output impedance of the device is less than the recommended value. It's also important to ensure that the input voltage is within the recommended range and that the device is operated within its specified temperature range.
  • The ADP1052ACPZ-R7 can deliver up to 2A of output current. However, the maximum output current may be limited by the thermal performance of the device and the PCB. It's essential to ensure that the device is properly heatsinked and that the PCB is designed to handle the maximum output current.
  • The ADP1052ACPZ-R7 can be programmed using an external resistor divider network connected to the FB pin. The output voltage can be calculated using the formula: VOUT = 0.8V x (R1 + R2) / R2, where R1 and R2 are the resistors in the divider network.
  • The typical efficiency of the ADP1052ACPZ-R7 is around 95% at full load. However, the actual efficiency may vary depending on the input voltage, output voltage, and output current.

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ADP1052ACPZ-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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