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ADP165ACPZN-1.2-R7 - Analog Devices

Description: LDO Regulator Pos 1.2V to 4.2V 6-Pin LFCSP EP T/R

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ADP165ACPZN-1.2-R7 - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - CP-6-3 (Thickness 0.65)
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ADP165ACPZN-1.2-R7 - Analog Devices  - 3D model - Small Outline No-lead - CP-6-3 (Thickness 0.65)
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ADP165ACPZN-1.2-R7 Details

  • Manufacturer Part Number:

    ADP165ACPZN-1.2-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    CP-6-3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.5 V

  • Dropout Voltage1-Nom:

    0.5 V

  • Input Voltage Absolute-Max:

    6.5 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.2 V

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Load Regulation-Max:

    0.017988%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    1.242 V

  • Output Voltage1-Min:

    1.158 V

  • Output Voltage1-Nom:

    1.2 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.08,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.65 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3.5%

  • Width:

    2 mm

ADP165ACPZN-1.2-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the ADP165ACPZN-1.2-R7. Ensure a solid ground plane, keep the input and output traces short and separate, and use a common mode choke to reduce EMI. Refer to Analog Devices' application notes and layout guidelines for more information.
  • The input capacitor (CIN) should be a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 1 μF to 10 μF. The output capacitor (COUT) should be a low-ESR ceramic or tantalum capacitor with a value between 1 μF to 22 μF. Ensure the capacitors are rated for the maximum input and output voltages.
  • The ADP165ACPZN-1.2-R7 is rated for operation up to 125°C ambient temperature. However, for reliable long-term operation, it's recommended to keep the ambient temperature below 100°C to minimize thermal stress and ensure optimal performance.
  • While the ADP165ACPZN-1.2-R7 is a high-quality device, it's not specifically designed for high-reliability or automotive applications. For such applications, consider using devices with higher reliability ratings, such as those with AEC-Q100 or MIL-PRF-38535 certifications.
  • To ensure EMC, follow proper PCB layout and design guidelines, use a common mode choke, and add EMI filters or shielding as needed. Also, ensure the device is properly decoupled and the input and output lines are properly terminated.

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ADP165ACPZN-1.2-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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