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ADP165ACPZN-R7 - Analog Devices

Description: LDO Voltage Regulators Low Iq LDO with Passthrough option

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ADP165ACPZN-R7 - Analog Devices - PCB symbol
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PCB Footprints
ADP165ACPZN-R7 - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - 6-Lead Lead Frame Chip Scale Package [LFCSP_UD] 2.00 mm × 2.00 mm Body, Ultra Thin, Dual Lead (CP-6-3)
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3D Models
ADP165ACPZN-R7 - Analog Devices - 3D model - Small Outline No-lead - 6-Lead Lead Frame Chip Scale Package [LFCSP_UD] 2.00 mm × 2.00 mm Body, Ultra Thin, Dual Lead (CP-6-3)
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ADP165ACPZN-R7 Details

  • Manufacturer Part Number:

    ADP165ACPZN-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    CP-6-3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Nom:

    0.5 V

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Line Regulation-Max (%/V):

    0.1

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    1.03 V

  • Output Voltage1-Min:

    0.97 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.08,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.65 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

ADP165ACPZN-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the ADP165ACPZN-R7. Ensure a solid ground plane, keep the input and output traces separate, and use a low-ESR capacitor for the output filter. Refer to the ADP165 evaluation board layout as a reference.
  • The output capacitor value depends on the output voltage, load current, and desired ripple voltage. A general guideline is to use a capacitor with a value between 10uF to 22uF, with a low ESR (Equivalent Series Resistance) and a voltage rating higher than the output voltage.
  • The absolute maximum input voltage rating is 6V. However, it's recommended to operate the device within the specified input voltage range of 2.7V to 5.5V for optimal performance and reliability.
  • The ADP165ACPZN-R7 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Ensure proper thermal management and consider derating the output current and voltage according to the temperature derating curves in the datasheet.
  • To ensure stability, follow the recommended PCB layout, use a low-ESR output capacitor, and add a small ceramic capacitor (e.g., 10nF) between the VIN and GND pins. Additionally, ensure the input voltage is within the specified range and the output current is within the recommended limits.

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ADP165ACPZN-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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