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ADP165AUJZ-3.0-R7 - Analog Devices

Description: ANALOG DEVICES - ADP165AUJZ-3.0-R7 - LDO Voltage Regulator, Fixed, 2.2 V to 5.5 V in, 3 V out, 0.15 A out, TSOT-5

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ADP165AUJZ-3.0-R7 - Analog Devices PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5-LEAD THIN SMALL OUTLINE TRANSISTOR PACKAGE [TSOT] (UJ-5)
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ADP165AUJZ-3.0-R7 - Analog Devices  - 3D model - SOT23 (5-Pin) - 5-LEAD THIN SMALL OUTLINE TRANSISTOR PACKAGE [TSOT] (UJ-5)
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ADP165AUJZ-3.0-R7 Details

  • Manufacturer Part Number:

    ADP165AUJZ-3.0-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOT-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    UJ-5

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.5 V

  • Dropout Voltage1-Nom:

    0.5 V

  • Input Voltage Absolute-Max:

    6.5 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3.5 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Load Regulation-Max:

    0.04497%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    3.105 V

  • Output Voltage1-Min:

    2.895 V

  • Output Voltage1-Nom:

    3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3.5%

  • Width:

    1.6 mm

ADP165AUJZ-3.0-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADP165AUJZ-3.0-R7 involves keeping the input and output traces separate, using a solid ground plane, and minimizing the length of the input traces. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper thermal management, it's recommended to attach a heat sink to the package, use a thermal interface material, and ensure good airflow around the device. The maximum junction temperature (TJ) should not exceed 125°C.
  • The recommended input capacitance for the ADP165AUJZ-3.0-R7 is 10nF to 100nF. However, the optimal input capacitance may vary depending on the specific application and input signal characteristics.
  • Yes, the ADP165AUJZ-3.0-R7 is suitable for high-reliability and aerospace applications. However, it's essential to follow the recommended operating conditions, and additional testing and qualification may be required for specific applications.
  • To troubleshoot common issues with the ADP165AUJZ-3.0-R7, check the PCB layout, input and output connections, and power supply quality. Ensure that the device is operated within the recommended specifications, and consult the datasheet and application notes for guidance.

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ADP165AUJZ-3.0-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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