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ADP172ACBZ-3.0-R7 - Analog Devices

Description: CMOS Linear Regulator

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ADP172ACBZ-3.0-R7 - Analog Devices PCB footprint - Other - Other - BGA4C50P2X2_102X95X64
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ADP172ACBZ-3.0-R7 - Analog Devices  - 3D model - Other - BGA4C50P2X2_102X95X64
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ADP172ACBZ-3.0-R7 Details

  • Manufacturer Part Number:

    ADP172ACBZ-3.0-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    WLCSP-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    CB-4-4

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.1 V

  • Dropout Voltage1-Nom:

    0.05 V

  • Input Voltage Absolute-Max:

    4 V

  • Input Voltage-Max:

    3.6 V

  • Input Voltage-Min:

    1.6 V

  • JESD-30 Code:

    R-PBGA-B4

  • JESD-609 Code:

    e1

  • Length:

    1.025 mm

  • Line Regulation-Max:

    0.00075%

  • Load Regulation-Max:

    0.04485%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    3.045 V

  • Output Voltage1-Min:

    2.91 V

  • Output Voltage1-Nom:

    3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.64 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3%

  • Width:

    0.95 mm

ADP172ACBZ-3.0-R7 Frequently Asked Questions (FAQs)

  • The ADP172ACBZ-3.0-R7 can handle input voltages up to 15V, but it's recommended to operate within the specified input voltage range of 2.7V to 5.5V for optimal performance.
  • To ensure stability, it's essential to follow the recommended PCB layout guidelines, use a sufficient output capacitor, and ensure that the input voltage is within the specified range. Additionally, the output voltage should be decoupled with a capacitor to prevent oscillations.
  • The ADP172ACBZ-3.0-R7 can provide a maximum output current of 300mA. However, the output current should be limited to 200mA for optimal performance and to prevent overheating.
  • The output voltage of the ADP172ACBZ-3.0-R7 can be adjusted by using an external resistor divider network. The output voltage can be set to any value between 0.8V and 5.5V by selecting the appropriate resistor values.
  • The ADP172ACBZ-3.0-R7 is rated for operation up to 125°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures, so it's essential to follow the recommended operating conditions.

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ADP172ACBZ-3.0-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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