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ADP2504ACPZ-3.3-R7 - Analog Devices

Description: ANALOG DEVICES - ADP2504ACPZ-3.3-R7 - Buck-Boost Switching Regulator, Fixed, 2.3 V to 5 V In, 3.3 V/1 A Out, 2.5 MHz, LFCSP-10

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ADP2504ACPZ-3.3-R7 - Analog Devices - PCB symbol
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PCB Footprints
ADP2504ACPZ-3.3-R7 - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - CP-10-9 (LFCSP)
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ADP2504ACPZ-3.3-R7 - Analog Devices - 3D model - Small Outline No-lead - CP-10-9 (LFCSP)
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ADP2504ACPZ-3.3-R7 Details

  • Manufacturer Part Number:

    ADP2504ACPZ-3.3-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    10

  • Manufacturer Package Code:

    CP-10-9

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.3 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    S-XBCS-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    STYLE CHIP SCALE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    2900 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

ADP2504ACPZ-3.3-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADP2504ACPZ-3.3-R7 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance.
  • To ensure the ADP2504ACPZ-3.3-R7 operates within its specified temperature range, provide adequate heat sinking, avoid overheating, and ensure good airflow around the device. Also, consider using thermal interface materials to improve heat transfer.
  • Exceeding the maximum input voltage rating of the ADP2504ACPZ-3.3-R7 can cause permanent damage to the device, including overheating, electrical overstress, and reduced reliability. Always ensure the input voltage is within the specified range.
  • To troubleshoot issues with the ADP2504ACPZ-3.3-R7, check the input voltage, output load, and PCB layout. Verify that the device is operated within its specified temperature range and that the input and output capacitors are of sufficient value and quality. Consult the datasheet and application notes for guidance.
  • The ADP2504ACPZ-3.3-R7 is a commercial-grade device, and its use in high-reliability or safety-critical applications may require additional qualification and testing. Consult with Analog Devices Inc. or a qualified reliability engineer to determine the device's suitability for such applications.

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ADP2504ACPZ-3.3-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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