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ADP5061ACBZ-4-R7 - Analog Devices

Description: Battery Management I2C Prog Linear Battery Charger

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ADP5061ACBZ-4-R7 - Analog Devices - PCB symbol
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PCB Footprints
ADP5061ACBZ-4-R7 - Analog Devices PCB footprint - BGA - BGA - WLCSP20
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ADP5061ACBZ-4-R7 - Analog Devices - 3D model - BGA - WLCSP20
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ADP5061ACBZ-4-R7 Details

  • Manufacturer Part Number:

    ADP5061ACBZ-4-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WLCSP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    CB-20-9

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    R-PBGA-B20

  • JESD-609 Code:

    e1

  • Length:

    2.595 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA20,4X5,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.66 mm

  • Supply Current-Max (Isup):

    1500 mA

  • Supply Voltage-Max (Vsup):

    6.7 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    DMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    1.995 mm

ADP5061ACBZ-4-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADP5061ACBZ-4-R7 involves separating the analog and digital grounds, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • To ensure proper power-up and configuration, it's recommended to follow a specific power-up sequence, which includes applying the input voltage, waiting for the internal voltage regulator to stabilize, and then configuring the device through the I2C interface. The datasheet provides a detailed power-up sequence diagram.
  • The ADP5061ACBZ-4-R7 has a maximum junction temperature of 125°C. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the airflow around the device. Additionally, follow the recommended PCB layout guidelines to minimize thermal resistance.
  • To troubleshoot issues with the ADP5061ACBZ-4-R7, start by verifying the power-up sequence, checking the input voltage and current, and verifying the configuration registers through the I2C interface. Use an oscilloscope to monitor the output voltages and currents, and consult the datasheet for troubleshooting guidelines.
  • Yes, the ADP5061ACBZ-4-R7 is a switching regulator and can generate EMI. To minimize EMI, use a shielded inductor, place the input and output capacitors close to the device, and use a common-mode choke on the input lines. Additionally, follow the recommended PCB layout guidelines to minimize EMI.

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ADP5061ACBZ-4-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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