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ADP5589ACPZ-00-R7 - Analog Devices

Description: I2C Interface 3.6V 24-Pin LFCSP EP T/R

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PCB Footprints
ADP5589ACPZ-00-R7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - [LFCSP_WQ](CP-24-11)
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3D Models
ADP5589ACPZ-00-R7 - Analog Devices  - 3D model - Quad Flat No-Lead - [LFCSP_WQ](CP-24-11)
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ADP5589ACPZ-00-R7 Details

  • Manufacturer Part Number:

    ADP5589ACPZ-00-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    LFCSP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    CP-24-11

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Clock Frequency-Max:

    1 MHz

  • JESD-30 Code:

    S-XQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    3.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    19

  • Number of Ports:

    19

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.14SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.65 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.5 mm

  • uPs/uCs/Peripheral ICs Type:

    PARALLEL IO PORT, GENERAL PURPOSE

ADP5589ACPZ-00-R7 Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow a 4-layer PCB stack-up with a solid ground plane, and to place thermal vias under the device to dissipate heat. A thermal pad on the bottom of the package should be connected to a copper plane on the PCB to improve heat dissipation.
  • To ensure reliable operation across the entire operating temperature range, it's essential to follow proper PCB design and layout guidelines, and to consider the device's thermal characteristics. Additionally, ensure that the device is operated within its specified voltage and current limits, and that the system is designed to mitigate thermal gradients and hotspots.
  • For optimal performance, it's recommended to use a pi-filter (R-C-R) configuration at the input, and a decoupling capacitor (e.g., 10uF) at the output. Additionally, consider using a ferrite bead or a common-mode choke to filter out high-frequency noise.
  • To troubleshoot and debug issues, start by verifying the power supply voltage, input signals, and output loads. Use an oscilloscope to monitor the input and output waveforms, and check for any signs of oscillation or instability. Consult the datasheet and application notes for guidance on troubleshooting common issues.
  • Operating the device beyond its specified maximum ratings can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to ensure that the device is operated within its specified voltage, current, and temperature limits to ensure reliable operation and to prevent damage to the device.

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ADP5589ACPZ-00-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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