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ADP7105ACPZ-R7 - Analog Devices

Description: ANALOG DEVICES - ADP7105ACPZ-R7 - LDO Voltage Regulator, Adjustable, 3.3V to 20V in, 350mV drop, 1.22V to 19V/0.5A out, LFCSP-8

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ADP7105ACPZ-R7 - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - CP-8-5 (LFCSP_WD)
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ADP7105ACPZ-R7 - Analog Devices  - 3D model - Small Outline No-lead - CP-8-5 (LFCSP_WD)
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ADP7105ACPZ-R7 Details

  • Manufacturer Part Number:

    ADP7105ACPZ-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    CP-8-5

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.55 V

  • Dropout Voltage1-Nom:

    0.35 V

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max (%/V):

    0.015

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Voltage1-Max:

    19 V

  • Output Voltage1-Min:

    1.22 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.11,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    0.38%

  • Width:

    3 mm

ADP7105ACPZ-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADP7105ACPZ-R7 involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the output capacitor is properly sized and placed close to the device. It's also important to decouple the input and output with capacitors to prevent oscillation.
  • The ADP7105ACPZ-R7 can handle input voltages up to 15V, but it's recommended to operate within the specified input voltage range of 4.5V to 14V for optimal performance and reliability.
  • The ADP7105ACPZ-R7 is rated for operation up to 125°C, but it's recommended to derate the output current and voltage at higher temperatures to ensure reliability and prevent overheating.
  • To troubleshoot issues with the ADP7105ACPZ-R7, start by checking the input voltage, output voltage, and output current. Verify that the device is properly soldered and that the PCB layout is correct. Check for signs of overheating, such as excessive temperature or burning smells. If the issue persists, consult the datasheet and application notes for guidance.

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ADP7105ACPZ-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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