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ADR360BUJZ-R2 - Analog Devices

Description: Analog Devices ADR360BUJZ-R2, Series Voltage Reference 2.048V, ±0.15% 18 V max., 5-Pin TSOT

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PCB Footprints
ADR360BUJZ-R2 - Analog Devices PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5-LEAD THIN SMALL OUTLINE TRANSISTOR PACKAGE [TSOT] (UJ-5)
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3D Models
ADR360BUJZ-R2 - Analog Devices  - 3D model - SOT23 (5-Pin) - 5-LEAD THIN SMALL OUTLINE TRANSISTOR PACKAGE [TSOT] (UJ-5)
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ADR360BUJZ-R2 Details

  • Manufacturer Part Number:

    ADR360BUJZ-R2

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOT

  • Package Description:

    ROHS COMPLIANT, MO-193AB, TSOT-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    UJ-5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    2.051 V

  • Output Voltage-Min:

    2.045 V

  • Output Voltage-Nom:

    2.048 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    15 V

  • Supply Voltage-Min (Vsup):

    2.35 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temp Coef of Voltage-Max:

    9 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Trim/Adjustable Output:

    YES

  • Voltage Tolerance-Max:

    0.15%

  • Width:

    1.6 mm

ADR360BUJZ-R2 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADR360BUJZ-R2 involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure accurate voltage reference output, make sure to decouple the input pin with a 10nF capacitor, use a low-impedance output capacitor (e.g., 10uF), and keep the output current within the specified range (up to 5mA). Also, avoid loading the output with high-impedance circuits.
  • The thermal resistance (θJA) of the ADR360BUJZ-R2 package is approximately 30°C/W. This means that for every watt of power dissipated, the junction temperature will rise by 30°C above the ambient temperature.
  • No, the ADR360BUJZ-R2 is a voltage reference device, not a voltage regulator. It is designed to provide a stable voltage reference, but it does not have the capability to regulate voltage or provide a high current output.
  • To minimize noise sensitivity, use a low-noise power supply, decouple the input pin, and keep the device away from high-frequency noise sources. Additionally, consider using a noise-reducing capacitor (e.g., 100nF) between the input pin and ground.

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ADR360BUJZ-R2 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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