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ADR361AUJZ-REEL7 - Analog Devices

Description: Low Power, Low Noise Voltage References with Sink/Source Capability

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ADR361AUJZ-REEL7 - Analog Devices PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOT 5 pin
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ADR361AUJZ-REEL7 - Analog Devices  - 3D model - SOT23 (5-Pin) - TSOT 5 pin
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ADR361AUJZ-REEL7 Details

  • Manufacturer Part Number:

    ADR361AUJZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOT

  • Package Description:

    ROHS COMPLIANT, MO-193AB, TSOT-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    UJ-5

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    2.506 V

  • Output Voltage-Min:

    2.494 V

  • Output Voltage-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    15 V

  • Supply Voltage-Min (Vsup):

    2.8 V

  • Supply Voltage-Nom (Vsup):

    3.5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temp Coef of Voltage-Max:

    25 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    YES

  • Voltage Tolerance-Max:

    0.24%

  • Width:

    1.6 mm

ADR361AUJZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADR361AUJZ-REEL7 involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure proper biasing, connect the VDD pin to a stable voltage source between 2.7V and 5.5V, and the VSS pin to a solid ground plane. The input voltage should be within the recommended range, and the output should be decoupled with a capacitor to prevent oscillations.
  • The recommended input voltage range for the ADR361AUJZ-REEL7 is between 1.9V and VDD-1.5V. Operating outside this range may affect the device's accuracy and linearity.
  • To minimize noise sensitivity, use a low-noise voltage regulator, add decoupling capacitors close to the device, and keep the input and output traces short and separate. Shielding the device and using a solid ground plane can also help reduce noise sensitivity.
  • The ADR361AUJZ-REEL7 has a thermal pad on the bottom of the package. To ensure proper thermal management, use a thermal interface material (TIM) between the thermal pad and a heat sink or a metal plate on the PCB. This helps to dissipate heat and prevent thermal shutdown.

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ADR361AUJZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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