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ADR421BRZ - Analog Devices

Description: Ultraprecision, Low Noise, 2.048 V/2.500 V/ 3.00 V/5.00 V XFET® Voltage References

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ADR421BRZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - NARROW BODY R-8
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ADR421BRZ Details

  • Manufacturer Part Number:

    ADR421BRZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, MS-012AA, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    R-8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    OUTPUT VOLTAGE CAN BE ADJUSTED OVER A +/-0.5% RANGE USING TRIM PIN

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    2.501 V

  • Output Voltage-Min:

    2.499 V

  • Output Voltage-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    15 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temp Coef of Voltage-Max:

    3 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    YES

  • Voltage Tolerance-Max:

    0.12%

  • Width:

    3.9 mm

ADR421BRZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADR421BRZ involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog ground plane to minimize noise and ensure optimal performance.
  • To ensure the ADR421BRZ operates within its specified temperature range, it's essential to provide adequate heat sinking and thermal management. This can be achieved by using a heat sink, ensuring good airflow, and keeping the device away from other heat sources.
  • The recommended input voltage range for the ADR421BRZ is 4.5V to 18V. The output voltage is regulated to 4.096V ± 0.4% (max) for input voltages between 4.5V and 18V. Operating outside this range may affect the output voltage accuracy and stability.
  • To minimize noise sensitivity, use a low-pass filter at the input, keep the input traces short and away from noise sources, and use a capacitor (e.g., 10nF) between the input and ground. Additionally, consider using a shielded enclosure and keeping the device away from high-frequency sources.
  • The recommended output capacitor value for the ADR421BRZ is 10μF to 22μF. A larger capacitor value can improve stability, but may also increase the startup time. A smaller capacitor value may reduce the startup time but can compromise stability.

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ADR421BRZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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