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ADRF6850BCPZ - Analog Devices

Description: ADRF6850BCPZ, Demodulator Quadrature 250MHz 3.15 → 3.45 V 56-Pin LFCSP VQ

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ADRF6850BCPZ - Analog Devices - PCB symbol
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PCB Footprints
ADRF6850BCPZ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ], Tray_
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ADRF6850BCPZ - Analog Devices - 3D model - Quad Flat No-Lead - 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ], Tray_
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ADRF6850BCPZ Details

  • Manufacturer Part Number:

    ADRF6850BCPZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    8 X 8 MM, ROHS COMPLIANT, MO-220VLLD-2, LFCSP-56

  • Pin Count:

    56

  • Manufacturer Package Code:

    CP-56-5

  • Country Of Origin:

    Singapore

  • ECCN Code:

    5A991.B

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • JESD-30 Code:

    S-XQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    0.44 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    8 mm

ADRF6850BCPZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF signal traces as short as possible and use 50-ohm microstrip lines. Avoid vias and right-angle bends in the RF signal path.
  • Adjust the bias voltage (VCC) and current (ICC) to achieve the optimal quiescent current (IQ) for the desired linearity. Typically, IQ = 10-20 mA for maximum linearity. Monitor the output power and adjust the bias accordingly.
  • Use a pi-network or a T-network for input and output matching. The values of the matching components (L, C, and R) depend on the specific application and frequency band. Consult the application note or a microwave engineering textbook for guidance.
  • Use a low-noise amplifier (LNA) before the ADRF6850BCPZ to reduce the noise figure. Optimize the biasing and matching networks to minimize noise. Consider using a noise-reducing topology, such as a balanced amplifier.
  • The maximum operating temperature of the ADRF6850BCPZ is 125°C. However, the device's performance may degrade at high temperatures. Consult the datasheet for temperature-related specifications and derating factors.

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ADRF6850BCPZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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