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ADSP-21569KBCZ8 - Analog Devices

Description: Up to 1GHz SHARC+ DSP with 640KB L1, 1024KB Shared L2 SRAM, 400-Ball CSP_BGA

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ADSP-21569KBCZ8 - Analog Devices - PCB symbol
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PCB Footprints
ADSP-21569KBCZ8 - Analog Devices PCB footprint - BGA - BGA - 400-Ball Chip Scale Package Ball Grid Array
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3D Models
ADSP-21569KBCZ8 - Analog Devices - 3D model - BGA - 400-Ball Chip Scale Package Ball Grid Array
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ADSP-21569KBCZ8 Details

  • Manufacturer Part Number:

    ADSP-21569KBCZ8

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSBGA-400

  • Pin Count:

    400

  • Manufacturer Package Code:

    BC-400-3

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Address Bus Width:

    16

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    500 MHz

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B400

  • Length:

    17 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    400

  • Number of Timers:

    10

  • On Chip Data RAM Width:

    32

  • Operating Temperature-Max:

    110 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA400,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • RAM (words):

    163840

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.38 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-21569KBCZ8 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to power up the core voltage (VDD_INT) first, followed by the I/O voltage (VDD_IO). This ensures that the internal voltage regulators are powered up correctly.
  • To optimize performance, consider the following: use the highest possible clock frequency, optimize memory access patterns, use the cache and DMA controllers, and minimize the number of interrupts. Additionally, use the ADSP-21569KBCZ8's built-in performance monitoring units to identify bottlenecks.
  • The maximum operating temperature range for the ADSP-21569KBCZ8 is -40°C to +125°C. However, it's recommended to operate the device within the industrial temperature range of -40°C to +85°C for optimal performance and reliability.
  • To ensure EMC, follow proper PCB design guidelines, use shielding and grounding techniques, and implement electromagnetic interference (EMI) filters on the board. Additionally, consider using the ADSP-21569KBCZ8's built-in features such as spread spectrum clocking and clock domain separation to reduce EMI emissions.
  • The recommended method for debugging the ADSP-21569KBCZ8 is to use the VisualDSP++ development environment, which provides a comprehensive set of debugging tools, including a simulator, emulator, and debugger. Additionally, use the ADSP-21569KBCZ8's built-in debug features such as the Debug Interface and the CoreSight debug architecture.

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ADSP-21569KBCZ8 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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