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ADSP-BF512KSWZ-4 - Analog Devices

Description: Analog Devices ADSP-BF512KSWZ-4, 16bit Blackfin Digital Signal Processor 400MHz 116 kB OTP 176-Pin LQFP

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ADSP-BF512KSWZ-4 - Analog Devices - PCB symbol
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PCB Footprints
ADSP-BF512KSWZ-4 - Analog Devices PCB footprint - Quad Flat Packages - Quad Flat Packages - 176-Lead Low Profile Quad Flat Package [LQFP_EP] (SQ-176-2)
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3D Models
ADSP-BF512KSWZ-4 - Analog Devices - 3D model - Quad Flat Packages - 176-Lead Low Profile Quad Flat Package [LQFP_EP] (SQ-176-2)
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ADSP-BF512KSWZ-4 Details

  • Manufacturer Part Number:

    ADSP-BF512KSWZ-4

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    LQFP-176

  • Pin Count:

    176

  • Manufacturer Package Code:

    SQ-176-2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Address Bus Width:

    19

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    400 MHz

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQFP-G176

  • Length:

    24 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    176

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP176,1.0SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Speed:

    400 MHz

  • Supply Voltage-Max:

    1.47 V

  • Supply Voltage-Min:

    1.164 V

  • Supply Voltage-Nom:

    1.4 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    24 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-BF512KSWZ-4 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDDINT and VDDRTC simultaneously, followed by VDDPLL and VDDOSC. This ensures proper power-up and minimizes the risk of latch-up or other damage.
  • Optimizing performance requires understanding the application's requirements and configuring the processor accordingly. This includes selecting the optimal clock frequency, configuring the cache and memory, and optimizing the code using the compiler's optimization flags.
  • The ADSP-BF512KSWZ-4 has a maximum junction temperature of 125°C. Ensure good airflow, use a heat sink if necessary, and avoid blocking the airflow around the device. Also, consider using thermal interface materials to improve heat transfer.
  • To ensure EMC, follow proper PCB design practices, such as using a solid ground plane, minimizing signal trace lengths, and using shielding and filtering as needed. Also, ensure that the device is properly decoupled and that the power supply is well-regulated.
  • In harsh environments, consider the operating temperature range, humidity, and vibration. Ensure the device is properly packaged and sealed, and consider using conformal coating or potting to protect the device from environmental stressors.

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ADSP-BF512KSWZ-4 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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