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ADSP-BF522BBCZ-3A - Analog Devices

Description: Embedded Processor

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ADSP-BF522BBCZ-3A - Analog Devices PCB footprint - Other - Other - BGA208C80P20X20_1700X1700X175
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ADSP-BF522BBCZ-3A - Analog Devices  - 3D model - Other - BGA208C80P20X20_1700X1700X175
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ADSP-BF522BBCZ-3A Details

  • Manufacturer Part Number:

    ADSP-BF522BBCZ-3A

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    ROHS COMPLIANT, MO-275MMAB-1, CSPBGA-208

  • Pin Count:

    208

  • Manufacturer Package Code:

    BC-208-2

  • Country Of Origin:

    Singapore

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Address Bus Width:

    19

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    50 MHz

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B208

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA208,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Speed:

    300 MHz

  • Supply Voltage-Max:

    1.9 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-BF522BBCZ-3A Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDDINT and VDDRTC first, followed by VDDPLL and VDDOSC. This ensures that the internal voltage regulators are powered up correctly.
  • To optimize performance for low-power applications, use the Dynamic Voltage and Frequency Scaling (DVFS) feature, which allows the processor to dynamically adjust its voltage and frequency based on the workload. Additionally, use the Low Power Mode (LPM) to reduce power consumption when the processor is idle.
  • The maximum frequency of the ADSP-BF522BBCZ-3A is 400 MHz. To achieve this frequency, ensure that the processor is properly cooled, and the power supply voltage is set to the recommended value of 1.2V. Additionally, use the PLL clock multiplier to achieve the maximum frequency.
  • Implement a reliable boot process by using a boot loader that checks the integrity of the firmware image before booting. Additionally, use the processor's built-in boot ROM to load the boot loader, and ensure that the boot loader is configured to handle errors and exceptions correctly.
  • When designing a PCB for the ADSP-BF522BBCZ-3A, consider the following: use a 4-layer PCB with a solid ground plane, keep the signal traces short and direct, use decoupling capacitors to reduce noise, and ensure that the power supply is clean and stable.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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