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ADSP-BF561SBB600 - Analog Devices

Description: Digital Signal Processors & Controllers - DSP, DSC Blackfin Symmetric Multi-Processor

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PCB Footprints
ADSP-BF561SBB600 - Analog Devices PCB footprint - BGA - BGA - (PBGA) (B-297)
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ADSP-BF561SBB600 - Analog Devices  - 3D model - BGA - (PBGA) (B-297)
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ADSP-BF561SBB600 Details

  • Manufacturer Part Number:

    ADSP-BF561SBB600

  • Source Url Status Check Date:

    2013-05-01 14:56:49.09

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    PLASTIC, MS-0340AAL-1, BGA-297

  • Pin Count:

    297

  • Manufacturer Package Code:

    B-297

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY

  • Address Bus Width:

    23

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    600 MHz

  • External Data Bus Width:

    32

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B297

  • JESD-609 Code:

    e0

  • Length:

    27 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    297

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA297,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.43 mm

  • Speed:

    600 MHz

  • Supply Voltage-Max:

    1.4185 V

  • Supply Voltage-Min:

    0.8 V

  • Supply Voltage-Nom:

    1.35 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead/Silver (Sn/Pb/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-BF561SBB600 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDDINT and VDDRTC simultaneously, followed by VDDPLL and VDDOSC. This ensures proper power-up and minimizes the risk of latch-up or other damage.
  • Optimizing performance involves understanding the application's requirements and configuring the processor accordingly. This includes selecting the optimal clock frequency, configuring the cache and DMA, and optimizing the memory hierarchy. Analog Devices provides tools and documentation to help with this process.
  • The ADSP-BF561SBB600 has a maximum junction temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and airflow to keep the device within its recommended operating temperature range.
  • To ensure EMC, follow proper PCB design and layout guidelines, use shielding and filtering as needed, and ensure that the device is properly grounded. Additionally, follow the guidelines in the datasheet for minimizing electromagnetic interference (EMI).
  • When using the ADSP-BF561SBB600 in a harsh environment, consider the operating temperature range, humidity, and vibration. Ensure that the device is properly packaged and sealed to prevent moisture and contaminants from entering the package.

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ADSP-BF561SBB600 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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