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ADSP-BF561SBBZ500 - Analog Devices

Description: Analog Devices ADSP-BF561SBBZ500, 16bit Digital Signal Processor 250MHz ROMLess 297-Pin PBGA

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ADSP-BF561SBBZ500 - Analog Devices PCB footprint - BGA - BGA - 297-Ball Plastic Ball Grid Array (PBGA) (B-297)
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ADSP-BF561SBBZ500 - Analog Devices  - 3D model - BGA - 297-Ball Plastic Ball Grid Array (PBGA) (B-297)
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ADSP-BF561SBBZ500 Details

  • Manufacturer Part Number:

    ADSP-BF561SBBZ500

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    ROHS COMPLIANT, PLASTIC, MS-0340AAL-1, BGA-297

  • Pin Count:

    297

  • Manufacturer Package Code:

    B-297

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY

  • Address Bus Width:

    23

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    500 MHz

  • External Data Bus Width:

    32

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B297

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    297

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA297,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.43 mm

  • Speed:

    500 MHz

  • Supply Voltage-Max:

    1.375 V

  • Supply Voltage-Min:

    0.8 V

  • Supply Voltage-Nom:

    1.25 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-BF561SBBZ500 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDDINT and VDDRTC simultaneously, followed by VDDPLL and VDDOSC. This ensures proper power-up and minimizes the risk of latch-up or other damage.
  • The EMIF can be configured using the EMIF control registers. The configuration depends on the type of memory used (e.g., SDRAM, DDR, or asynchronous memory). Refer to the ADSP-BF561 Blackfin Processor Hardware Reference manual for detailed configuration information.
  • The maximum clock frequency supported by the ADSP-BF561SBBZ500 is 500 MHz. However, the actual clock frequency may be limited by the specific application and system design.
  • The ADSP-BF561SBBZ500 has a built-in watchdog timer (WDT) that can be enabled and configured using the WDT control registers. The WDT can be used to reset the processor in case of a software fault or hang.
  • The PLL is used to generate the internal clock signals for the processor core, peripherals, and memory interfaces. It allows for flexible clock frequency generation and can be configured to support various clock frequencies and modes.

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ADSP-BF561SBBZ500 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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