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ADSP-BF609BBCZ-5 - Analog Devices

Description: Blackfin Dual-Core Processor up to 1GHz with Hardware Support for HD Video Analytics

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ADSP-BF609BBCZ-5 - Analog Devices PCB footprint - BGA - BGA - ADSP(BC-349-1)
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ADSP-BF609BBCZ-5 - Analog Devices  - 3D model - BGA - ADSP(BC-349-1)
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ADSP-BF609BBCZ-5 Details

  • Manufacturer Part Number:

    ADSP-BF609BBCZ-5

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSBGA-349

  • Pin Count:

    349

  • Manufacturer Package Code:

    BC-349-1

  • Country Of Origin:

    South Korea

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Address Bus Width:

    25

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    60 MHz

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B349

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of External Interrupts:

    6

  • Number of Serial I/Os:

    3

  • Number of Terminals:

    349

  • Number of Timers:

    8

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA349,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Qualification Status:

    Not Qualified

  • RAM (words):

    413696

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.19 V

  • Supply Voltage-Nom:

    1.25 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, MIXED

ADSP-BF609BBCZ-5 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD_INT and VDD_DDR simultaneously, followed by VDD_CORE and VDD_PLL. This ensures proper power-up and minimizes the risk of latch-up or other damage.
  • To optimize performance, consider the following: use the highest possible clock frequency, optimize memory access patterns, use the cache effectively, and minimize the number of context switches. Additionally, use the VisualDSP++ development environment to analyze and optimize your code.
  • The ADSP-BF609BBCZ-5 has a maximum junction temperature of 125°C. Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the airflow around the device. Also, consider using thermal interface materials to improve heat transfer.
  • To ensure EMC, follow proper PCB design practices, use shielding and filtering, and minimize noise radiation. Also, ensure that the device is properly grounded and that all cables and connectors are properly shielded.
  • In harsh environments, consider the operating temperature range, humidity, and vibration. Ensure the device is properly packaged and sealed, and consider using conformal coating or potting to protect the device from environmental stresses.

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ADSP-BF609BBCZ-5 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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